QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager. - презентация

1 QNX Software Systems Ltd. & EID, Intel Corporation Collaborate Ron Sluder EID Software Engineering Manager Yvette Maldonado Business Alliance Manager

2 2 AgendaAgenda QNX/Intel Educational Announcement Joint Program Intention Intels Worldwide Educational Programs Embedded Intel Architecture Division Focus Conclusion

3 3 QNX/Intel Announce Joint Global Education Program Announcement: –Collaborating to bring the most advanced hardware and software platforms to universities and technical colleges through a joint Global Education Collaboration Qualifying institutions will receive a range of hardware platforms, from low-power Ultra Low Voltage Intel® Celeron® processor based systems to server-class Dual Processor Intel® Pentium® III processor systems along with a QNX® Momentics® Professional Edition development suite The Global Education Program is an extension of QNX and Intels existing educational outreach programs.

4 4 Program Intentions To enable and increase the quality of engineering graduates coming into the industry by providing them with state-of-the-art tools and techniques. Offer colleges and universities a cost-effective way to acquire commercial software and hardware for: –Classroom instruction –Academic research to help ensure that engineering graduates enter into the industry Students will be able to experiment and familiarize themselves with the very same tools that industry leaders employ for cutting edge design and development. Goal: To be known among students as the leaders in the industry.

5 5 Intels Worldwide Educational Programs Intel® Innovation in Education Intel International Science and Engineering Fair Intel Teach to the Future Intel University Programs

6 6 The Intel® Innovation in Education Mission: Prepare a highly skilled workforce by investing in strategic education programs that focus on science, technology, engineering, and mathematics. Objectives: Increase the effective & innovative use of technology in teaching & learning Accelerate the advancement of university curricula and research in strategic technology areas Improve technical fluency & problem solving skills among under-served youth via effective community-based education

7 7 Intel International Science and Engineering Fair The world's only international science fair representing all life sciences for students. Every year, more than one million students compete in regional science fairs and nearly 500 Intel ISEF-affiliated fairs held around the world. Students from 40+ countries win the chance to compete for more than US$3 million in scholarships and prizes in 14 scientific categories and a team project category. Additional information at:

8 8 Intel Teach to the Future Intel Teach to the Future is a free professional development program focused on the integration of computer technology to enhance student learning. Teacher led workshops focus on the creation of curricular units and evaluation tools to address standards. The program incorporates use of the Internet, Web page design, and student projects. Over ONE MILLION teachers in 30 countries have been trained to date, including Russia. www97.intel.com/education/teach/index.htm

9 9 Intel University Programs Intel fosters collaboration between industry and academia through equipment grants, scholarships and fellowships, research grants, and lectures by senior Intel technologists. Intel's support of higher education curricula and research extends to more than 75 schools in 25 countries. Opportunities Available: University Research Grants Intel Sponsored University Laboratories Intel Academic Relations Intel Research Award Contest

10 10 Embedded Intel Architecture Division Focus

11 11 Trends in Embedded Processing General-Purpose Processors Replace Deeply Embedded Proprietary Silicon –Driven by advances in PC industry –Pervasive MIPS –Commercial off-the-shelf (COTS) components Technology Continues to Progress –Specialized SW applications –Designed to standardized platforms: processors, OS and boards Internet Continues to Grow –Rise of pervasive IP networks –Driving growth of embedded applications Before: Proprietary Before: Proprietary Transition to Standard Modular Building Blocks After: Standardized After: Standardized

12 12 Intel ® Architecture in Embedded and Communications Market Segments Interactive Clients –Point-of-Sale –ATM –Kiosk –Gaming and Entertainment Storage –NAS –SAN –DAS Industrial Automation –Industrial Control –Factory Automation –Medical Imaging Wireless Infrastructure –2.5G/3G Rollout –Gateways Wireline Infrastructure –Security –Service Provisioning –Media Gateways

13 13 Mapping Intel ® Architecture Value to Embedded and Communications Intel Technology –Universal acceptance of Intel® Architecture –Intel investment in R&D and manufacturing –Extended lifecycle support Scalable Product Roadmap –High performance –I/O bandwidth –Scalability Rich Ecosystem –Platform enabling with board, system, and tools vendors –Extensive SW development environment –Development tools and middleware –System-level building blocks

14 14 Embedded IA Value Proposition Product Line Stability –5 year life cycle for EID roadmap components Vertical Market Segment –Tailored Platform Configurations for Embedded Markets World class technical support –Broad OS support PC Economies of Scale –Volume Manufacturing –Architecture Pervasiveness

15 15 Intel® Pentium® M Processor Arrives Intel® Pentium® M processpr = next generation low power processor Specifically designed for low power, high performance market segments 400MHz FSB 1MB L2 cache Geyserville III technology support 2 SKUs supported in embedded –1.6GHz (<24.5W), µFCBGA and µFCPGA –LV 1.1GHz (<12W), µFCBGA Architectural Solution for Power-Performance Balance

16 16 * Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance of Intel products, visit Pentium® M Processor Features More instructions per watt More efficient execution* –Predicts program flow better » Faster program execution –Changes tasks faster » Lower exception handling overhead –Instruction car-pooling » Faster packet handling: load, store –Multi-tasks faster » Lower context switching latency Power optimized circuitry » Lower average power –Cache and processor bus –Dynamic power control Bigger fast memory » Large-table look-ups: routing tables –Large L1/L2 caches

17 17 EIA: Scalable Product Roadmap CURRENTCURRENTDEVELOPMENTDEVELOPMENTFUTUREFUTURE ScaleablePerformanceScaleablePerformance Low Power HighPerformanceHighPerformance.13 μ 90nm90nm CURRENTCURRENTDEVELOPMENTDEVELOPMENTFUTUREFUTURE <30 Watt <7 Watt <15 Watt Frequency/PowerFrequency/Power Intel® Xeon Processor at 1.6GHz - 30 Watts Intel® Pentium M processor at 1.1/1.6GHz - 12/24.5 Watts Ultra Low Voltage Intel® Celeron® processor at 400MHz Watts Intel may make changes to specifications, product descriptions, and plans at any time, without notice

18 18 Enterprise Server MobileMobile * Other names and brands may be claimed as the property of others. PCI Express*: Cross Platform I/O Mobile Platforms GraphicsGraphics LANLAN Wi FiWi Fi Desktop Platforms LANLAN GraphicsGraphics Data Center Platforms IBA ClusteringIBA Clustering FC, SAS, SATA StorageFC, SAS, SATA Storage Ethernet LANEthernet LAN PCI Express*, X16 - Grfx WorkGroup Switch PCI Express*, X1 - GbE ICH6 WLAN Access Point Comm Platforms Chip to ChipChip to Chip Host base modulesHost base modules

19 19 Advanced Switching based on PCI Express* Architecture Shifts the host-centric paradigm of PCI to network- centric paradigm preferred in Comms (peer to peer) Encapsulation of upper layer protocols allows interoperability, tunneling capability preserve software investment Advanced Switching Traditional PCI Star Dual Star Mesh Efficient routing (Path based routing) with fail-over capabilities High availability & congestion avoidance mechanisms Multicast / Broadcast *Other names and brands may be claimed as the property of others.

20 20 QNX on Embedded Intel Architecture Broad product line support Leading RTOS for SMP environments True Hyper-threading support Utilizing IA thermal technologies for superior power management

21 21 QNX Roadmap Support Shipping Development All items subject to change. Intel® E7501 Intel® 855-GM QNX Neutrino, SIMD Intel® E7500 QNX Neutrino Intel® E7501 QNX Neutrino Intel® 810/815 QNX Neutrino Intel® 440MX, 440BX QNX Neutrino Intel® 810/815 Intel® 845E/GV Pentium® M Processor Intel® Xeon Processor Pentium® 4 Processor Pentium® III Processor Hyper-Threading Netburst SSE2 Geyserville III Processor Leading Technologies

22 22 ConclusionConclusion Intel Silicon Roadmap Embedded Lifecycle Support (5-7 yrs) Leadership in Manufacturing Leadership in Industry Initiatives Validated Platform Solutions Strong Technical Support World-Class Ecosystem Excellent Relationship with QNX EID Delivers Performance, Scalability, Low Power & Integrated features

23 23 Thank You! Intel, the Intel logo, Pentium, Celeron, and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.