Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation MSC.Nastran Thermal Analysis MSC.Nastran 2004 NAS104 Workshops March 2004 MSC.Software. - презентация

1 Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation MSC.Nastran Thermal Analysis MSC.Nastran 2004 NAS104 Workshops March 2004 MSC.Software Corporation United States MSC.Patran Support Tel: Fax: Tokyo, Japan Tel: Fax: Munich, Germany Tel: (+49) Fax: (+49) MacArthur Place Santa Ana, CA 92707, USA Tel: (714) Fax: (714) Web: Part Number: NA*V2004*Z*Z*Z*SM-NAS104-WBK

2 Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation DISCLAIMER MSC.Software Corporation reserves the right to make changes in specifications and other information contained in this document without prior notice. The concepts, methods, and examples presented in this text are for illustrative and educational purposes only, and are not intended to be exhaustive or to apply to any particular engineering problem or design. MSC.Software Corporation assumes no liability or responsibility to any person or company for direct or indirect damages resulting from the use of any information contained herein. User Documentation: Copyright 2004 MSC.Software Corporation. Printed in U.S.A. All Rights Reserved. This notice shall be marked on any reproduction of this documentation, in whole or in part. Any reproduction or distribution of this document, in whole or in part, without the prior written consent of MSC.Software Corporation is prohibited. MSC and MSC. are registered trademarks and service marks of MSC.Software Corporation. NASTRAN is a registered trademark of the National Aeronautics and Space Administration. MSC.Nastran is an enhanced proprietary version developed and maintained by MSC.Software Corporation. MSC.Patran is a trademark of MSC.Software Corporation. All other trademarks are the property of their respective owners.

3 Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation TABLE OF CONTENTS Workshop Page 1.0 Getting Started, Creating a Conduction Model ……………………………..……………………………… Circuit Board and Chips Using Conduction and Heating ……………………………………………… Free Convection From Printed Circuit Board …………..………………………………………………… Forced Air Convection From Printed Circuit Board …………..………………………………………… Axisymmetric Flow in a Pipe ……………………...………..…………………………………………………… Typical Avionics Flow ……………………………….…………………………………………………………… Thermal Contact Resistance …………………………………………………………………………………… Transient Thermal ……………………...………..………………………………………………………………… Transient Thermal Analysis of a Cooling Fin …………..…………………………………………………… Transient Analysis With Radiation Source… …………….………………………………..……………… Heating a Block of Icecream …………….………………..……………………………………………………… Solution of a Simple Radiation to Space Problem …………………………………….………..………… Directional Heat Loads …..………..……………………….………..…………………………………………… Radiation Enclosures …………………..…….………..………………………………………………………… Thermal Stress Analysis With Directional Heat Loads ……………………….………………………… Thermal Stress Analysis of a Bi-metalic Plate ……………………………….…………………………… Import IGES File and Auto tet Mesh ………………………….……………………………………………… Create Group and List ………………………….………………………………..………………………………… MSC.Nastran Bulk Data ………………….…….………………………………..………………………………… Shield ………………………………….…………….………………………………..………………………………… Thermal stress …………………….…………..….………………………………..…………………………………21-1

4 Copyright ® 2000 MSC.Software Copyright 2004 MSC.Software Corporation